Abstract
The transmission characteristics of wafer-scale interconnection lines, which were modeled by weakly coupled lossy transmission lines, were investigated using the exact solutions of line equations in frequency domain and a modified inverse FFT algorithm. For the driven line terminated in Z//o, interconnection length in wafer-scale integration (WSI) should be less than 15-20 cm to obtain high performance with low coupling. In the case of homogeneous dielectric structure, rise time dependent coupling is suppressed for both the lossless and lossy lines. However, other loss-induced coupling effects, which are not rise time dependent, still cause some far-end noise on lossy lines. Analytical results agreed with measurements.
| Original language | English |
|---|---|
| Title of host publication | Unknown Host Publication Title |
| Publisher | IEEE |
| Pages | 273-281 |
| Number of pages | 9 |
| ISBN (Print) | 0818607734 |
| Publication status | Published - 1987 |
All Science Journal Classification (ASJC) codes
- Engineering(all)