Manufacture and Behaviors of Superconducting Busbar Joint for ITER Correction Coil Feeder

Xinjie Wen, Xiongyi Huang, Kun Lu, Chen Liu, Chenglian Liu, Kaizhong Ding, Chunlong Zou, Chen Yu Gung, Jaromir Farek, Hyungjun Kim, Yury Ilin, Erwu Niu

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


International Thermonuclear Experimental Reactor (ITER) is the largest global cooperation project, which will be built as the world's largest tokamak to explore the commercial production of fusion-based electricity. In order to connect the busbars electrically and hydraulically, the 'shaking hands' twin-box type joint was designed and implemented for ITER project. Different from the conventional method, the indium bonding technology was developed instead of the Tin soldering method for the joint connection. In order to qualify for the ITER correction coil (CC) feeder joint structure and the manufacturing technology, Institute of Plasma Physics, Chinese Academy of Science (ASIPP) has launched the joint qualification on the manufacture process and the cryogenic performance. By means of the indium bonding, the joint resistance can be lower than 1 nΩ before and after the mechanical fatigue. This paper reports the structure and manufacturing process of CC feeder joint, describes the establishing of the testing setup, and finally discusses the cryogenic testing results. Besides the joint resistance, the pressure drop and the critical temperature are reported.

Original languageEnglish
Article number8651546
JournalIEEE Transactions on Applied Superconductivity
Issue number5
Publication statusPublished - 2019 Aug

Bibliographical note

Funding Information:
Manuscript received October 31, 2018; accepted February 20, 2019. Date of publication February 25, 2019; date of current version March 26, 2019. This work was supported in part by National Science Fund for Distinguished Young Scholars of China under Grant 51525703 and in part by National Science Foundation of China under Grant 51677185. (Corresponding author: Xiongyi Huang.) X. Wen, X. Huang, K. Lu, C. Liu, C. Liu, K. Ding, and C. Zou are with the Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031, China (e-mail:,

Publisher Copyright:
© 2002-2011 IEEE.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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