Joint structure in high brightness light emitting diode (HB LED) packages

Jin Woo Park, Young Bok Yoon, Sang Hyun Shin, Sang Hyun Choi

Research output: Contribution to journalArticlepeer-review

26 Citations (Scopus)


We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au-20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.

Original languageEnglish
Pages (from-to)357-361
Number of pages5
JournalMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Issue number1-2
Publication statusPublished - 2006 Dec 15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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