Inkjet-printing of nonsintered alumina-resin hybrid films and their dielectric Properties

Myung Sung Hwang, Jihoon Kim, Hyo Tae Kim, Youngjoon Yoon, Sangil Hyun, Jonghee Kim, Sung Nam Lee, Jooho Moon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We used the inkjet printing method to fabricate alumina-resin hybrid films without a high temperature sintering process. The dielectric properties of the alumina-resin hybrid films were studied in order to assess if the alumina-resin hybrid films are applicable to the electronic package substrates. Various numerical models were introduced to understand the relative permittivity of the alumina-resin hybrid films. Q-values of the alumina-resin hybrid films are also measured and compared to the commercially available substrate materials. The impact of microvoids on the Q-value of the inkjet-printed alumina-resin hybrid films was also studied. The microstructures of the inkjet-printed hybrid materials were investigated in order to confirm if the microvoids in the films were filled with the resin.

Original languageEnglish
Title of host publicationConference Record of the 29th Asilomar Conference on Signals, Systems and Computers, ACSSC 1995
EditorsAvtar Singh
PublisherIEEE Computer Society
ISBN (Electronic)0818673702
DOIs
Publication statusPublished - 1995
Event29th Asilomar Conference on Signals, Systems and Computers, ACSSC 1995 - Pacific Grove, United States
Duration: 1995 Oct 301995 Nov 1

Publication series

NameConference Record - Asilomar Conference on Signals, Systems and Computers
Volume1
ISSN (Print)1058-6393

Conference

Conference29th Asilomar Conference on Signals, Systems and Computers, ACSSC 1995
Country/TerritoryUnited States
CityPacific Grove
Period95/10/3095/11/1

Bibliographical note

Funding Information:
This research was supported by the core material development program, Ministry of Knowledge Economy, Korea under Grant No. M2007010011. This paper was presented at the international conference on flexible and printed electronics, Jeju, Korea 2009 (TA4-OR-03).

Publisher Copyright:
© 2010 American Institute of Physics.

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Computer Networks and Communications

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