In-Plane Deformation Mechanics for Highly Stretchable Electronics

Yewang Su; Xuecheng Ping; Ki Jun Yu; Jung Woo Lee; Jonathan A. Fan; Bo Wang; Ming Li; Rui Li; Daniel V. Harburg; Yong An Huang; Cunjiang Yu; Shimin Mao; Jaehoun Shim; Qinglin Yang; Pei Yin Lee; Agne Armonas; Ki Joong Choi; Yichen Yang; Ungyu Paik; Tammy Chang; Thomas J. Dawidczyk; Yonggang Huang; Shuodao Wang; John A. Rogers

doi:10.1002/adma.201604989

In-Plane Deformation Mechanics for Highly Stretchable Electronics

Yewang Su, Xuecheng Ping, Ki Jun Yu, Jung Woo Lee, Jonathan A. Fan, Bo Wang, Ming Li, Rui Li, Daniel V. Harburg, Yong An Huang, Cunjiang Yu, Shimin Mao, Jaehoun Shim, Qinglin Yang, Pei Yin Lee, Agne Armonas, Ki Joong Choi, Yichen Yang, Ungyu Paik, Tammy ChangThomas J. Dawidczyk, Yonggang Huang, Shuodao Wang, John A. Rogers

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

155 Citations (Scopus)

Original language	English
Article number	1604989
Journal	Advanced Materials
Volume	29
Issue number	8
DOIs	https://doi.org/10.1002/adma.201604989
Publication status	Published - 2017 Feb

Bibliographical note

Funding Information:
Y.S. acknowledges the support from Chinese Academy of Sciences via the “Hundred Talent program”, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741.

Funding Information:
Y.S. acknowledges the support from Chinese Academy of Sciences via the ?Hundred Talent program?, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741.

All Science Journal Classification (ASJC) codes

General Materials Science
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.201604989

Cite this

Su, Y., Ping, X., Yu, K. J., Lee, J. W., Fan, J. A., Wang, B., Li, M., Li, R., Harburg, D. V., Huang, Y. A., Yu, C., Mao, S., Shim, J., Yang, Q., Lee, P. Y., Armonas, A., Choi, K. J., Yang, Y., Paik, U., ... Rogers, J. A. (2017). In-Plane Deformation Mechanics for Highly Stretchable Electronics. Advanced Materials, 29(8), Article 1604989. https://doi.org/10.1002/adma.201604989

@article{8e2d127bf6b243f8a18e355e03ade9c1,

title = "In-Plane Deformation Mechanics for Highly Stretchable Electronics",

keywords = "buckling mechanics, non-buckling, scissoring, stretchable electronics",

author = "Yewang Su and Xuecheng Ping and Yu, {Ki Jun} and Lee, {Jung Woo} and Fan, {Jonathan A.} and Bo Wang and Ming Li and Rui Li and Harburg, {Daniel V.} and Huang, {Yong An} and Cunjiang Yu and Shimin Mao and Jaehoun Shim and Qinglin Yang and Lee, {Pei Yin} and Agne Armonas and Choi, {Ki Joong} and Yichen Yang and Ungyu Paik and Tammy Chang and Dawidczyk, {Thomas J.} and Yonggang Huang and Shuodao Wang and Rogers, {John A.}",

note = "Funding Information: Y.S. acknowledges the support from Chinese Academy of Sciences via the “Hundred Talent program”, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741. Funding Information: Y.S. acknowledges the support from Chinese Academy of Sciences via the ?Hundred Talent program?, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741.",

year = "2017",

month = feb,

doi = "10.1002/adma.201604989",

language = "English",

volume = "29",

journal = "Advanced Materials",

issn = "0935-9648",

publisher = "Wiley-Blackwell",

number = "8",

}

Su, Y, Ping, X, Yu, KJ, Lee, JW, Fan, JA, Wang, B, Li, M, Li, R, Harburg, DV, Huang, YA, Yu, C, Mao, S, Shim, J, Yang, Q, Lee, PY, Armonas, A, Choi, KJ, Yang, Y, Paik, U, Chang, T, Dawidczyk, TJ, Huang, Y, Wang, S & Rogers, JA 2017, 'In-Plane Deformation Mechanics for Highly Stretchable Electronics', Advanced Materials, vol. 29, no. 8, 1604989. https://doi.org/10.1002/adma.201604989

TY - JOUR

T1 - In-Plane Deformation Mechanics for Highly Stretchable Electronics

AU - Su, Yewang

AU - Ping, Xuecheng

AU - Yu, Ki Jun

AU - Lee, Jung Woo

AU - Fan, Jonathan A.

AU - Wang, Bo

AU - Li, Ming

AU - Li, Rui

AU - Harburg, Daniel V.

AU - Huang, Yong An

AU - Yu, Cunjiang

AU - Mao, Shimin

AU - Shim, Jaehoun

AU - Yang, Qinglin

AU - Lee, Pei Yin

AU - Armonas, Agne

AU - Choi, Ki Joong

AU - Yang, Yichen

AU - Paik, Ungyu

AU - Chang, Tammy

AU - Dawidczyk, Thomas J.

AU - Huang, Yonggang

AU - Wang, Shuodao

AU - Rogers, John A.

N1 - Funding Information: Y.S. acknowledges the support from Chinese Academy of Sciences via the “Hundred Talent program”, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741. Funding Information: Y.S. acknowledges the support from Chinese Academy of Sciences via the ?Hundred Talent program?, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741.

PY - 2017/2

Y1 - 2017/2

KW - buckling mechanics

KW - non-buckling

KW - scissoring

KW - stretchable electronics

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UR - http://www.scopus.com/inward/citedby.url?scp=85007109973&partnerID=8YFLogxK

U2 - 10.1002/adma.201604989

DO - 10.1002/adma.201604989

M3 - Article

C2 - 28004863

AN - SCOPUS:85007109973

SN - 0935-9648

VL - 29

JO - Advanced Materials

JF - Advanced Materials

IS - 8

M1 - 1604989

ER -

In-Plane Deformation Mechanics for Highly Stretchable Electronics

Bibliographical note

All Science Journal Classification (ASJC) codes

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