Improving memory ECC via defective memory columns

Joon Sung Yang

doi:10.1109/ISOCC.2015.7401654

Improving memory ECC via defective memory columns

Joon Sung Yang

College of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Due to the emergence of extremely high density memory and growing number of embedded memories, the memory yield became an important issue. In this paper, we proposed methods to exploit replaced defective columns to improve memory ECC. To utilize replaced defective columns, the defect information needs to be stored. In order to store defect information, the proposed method requires a spare column. Experimental results show that the proposed method can significantly improve the memory ECC.

Original language	English
Title of host publication	ISOCC 2015 - International SoC Design Conference
Subtitle of host publication	SoC for Internet of Everything (IoE)
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	63-64
Number of pages	2
ISBN (Electronic)	9781467393089
DOIs	https://doi.org/10.1109/ISOCC.2015.7401654
Publication status	Published - 2016 Feb 8
Event	12th International SoC Design Conference, ISOCC 2015 - Gyeongju, Korea, Republic of Duration: 2015 Nov 2 → 2015 Nov 5

Publication series

Name	ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)

Other

Other	12th International SoC Design Conference, ISOCC 2015
Country/Territory	Korea, Republic of
City	Gyeongju
Period	15/11/2 → 15/11/5

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ISOCC.2015.7401654

Cite this

Yang, J. S. (2016). Improving memory ECC via defective memory columns. In ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE) (pp. 63-64). Article 7401654 (ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2015.7401654

@inproceedings{ed8c84dd08bd4b48bf80e1bdebc00564,

title = "Improving memory ECC via defective memory columns",

abstract = "Due to the emergence of extremely high density memory and growing number of embedded memories, the memory yield became an important issue. In this paper, we proposed methods to exploit replaced defective columns to improve memory ECC. To utilize replaced defective columns, the defect information needs to be stored. In order to store defect information, the proposed method requires a spare column. Experimental results show that the proposed method can significantly improve the memory ECC.",

author = "Yang, {Joon Sung}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 12th International SoC Design Conference, ISOCC 2015 ; Conference date: 02-11-2015 Through 05-11-2015",

year = "2016",

month = feb,

day = "8",

doi = "10.1109/ISOCC.2015.7401654",

language = "English",

series = "ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "63--64",

booktitle = "ISOCC 2015 - International SoC Design Conference",

address = "United States",

}

Yang, JS 2016, Improving memory ECC via defective memory columns. in ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)., 7401654, ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE), Institute of Electrical and Electronics Engineers Inc., pp. 63-64, 12th International SoC Design Conference, ISOCC 2015, Gyeongju, Korea, Republic of, 15/11/2. https://doi.org/10.1109/ISOCC.2015.7401654

Improving memory ECC via defective memory columns. / Yang, Joon Sung.
ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE). Institute of Electrical and Electronics Engineers Inc., 2016. p. 63-64 7401654 (ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Improving memory ECC via defective memory columns

AU - Yang, Joon Sung

PY - 2016/2/8

Y1 - 2016/2/8

N2 - Due to the emergence of extremely high density memory and growing number of embedded memories, the memory yield became an important issue. In this paper, we proposed methods to exploit replaced defective columns to improve memory ECC. To utilize replaced defective columns, the defect information needs to be stored. In order to store defect information, the proposed method requires a spare column. Experimental results show that the proposed method can significantly improve the memory ECC.

AB - Due to the emergence of extremely high density memory and growing number of embedded memories, the memory yield became an important issue. In this paper, we proposed methods to exploit replaced defective columns to improve memory ECC. To utilize replaced defective columns, the defect information needs to be stored. In order to store defect information, the proposed method requires a spare column. Experimental results show that the proposed method can significantly improve the memory ECC.

UR - http://www.scopus.com/inward/record.url?scp=84963865464&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84963865464&partnerID=8YFLogxK

U2 - 10.1109/ISOCC.2015.7401654

DO - 10.1109/ISOCC.2015.7401654

M3 - Conference contribution

AN - SCOPUS:84963865464

T3 - ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)

SP - 63

EP - 64

BT - ISOCC 2015 - International SoC Design Conference

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th International SoC Design Conference, ISOCC 2015

Y2 - 2 November 2015 through 5 November 2015

ER -

Improving memory ECC via defective memory columns

Abstract

Publication series

Other

Bibliographical note

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this