Improvement of electrical properties of surfactant-templated mesoporous silica thin films by plasma treatment

Sang Bae Jung, Hyung Ho Park

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


Surfactant-templated mesoporous silica film draws a great attention due to its superior properties as low-k dielectrics. In this study, electrical properties of the film using Brij-76 surfactant were evaluated after plasma treatment. The selected gases were H2, O2, and Ar. X-ray diffraction pattern revealed that mesoporous silica film was highly textured but pore ordering was destroyed when applied rf power and atomic mass of gas increased. Strained Si-O bond near gel pore was reduced and incompletely oxidized Si bond could be controlled after plasma treatment. Optimizing treatment condition can control the structural defects in the wall and as a result, electrical property of the film could be improved. Mesoporous film after H2 plasma treatment at rf power of 25 W and 100 mTorr showed current density of 3.6 × 10- 6 A/cm2 at 1.6 MV/cm. As a conclusion, electrical properties of mesoporous silica film can be improved by plasma treatment through controlling reactivity of gas and ion bombardment effect with low power.

Original languageEnglish
Pages (from-to)360-363
Number of pages4
JournalThin Solid Films
Publication statusPublished - 2006 May 26

Bibliographical note

Funding Information:
The authors are indebted to the financial support from KISTEP (Program No. M1-0214-00-0228).

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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