Improved reduction of contact resistance in NiSi/Si junction using Holmium interlayer

Sunil Babu Eadi, Hyeong Sub Song, Hyun dong Song, Jungwoo Oh, Hi Deok Lee

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


In this study, effect of Ho interlayer was investigated in nickel silicide (NiSi)/Si junction for contact resistance reduction. A thin Holmium (Ho) interlayer was applied to Ni/(p/n)-Si contact to reduce contact resistance between NiSi and Si. Thickness of 5 nm Ho layer was first deposited on As-doped n-type Si layer and BF2-doped p-type Si layer, followed by in situ deposition of a 15 nm-thick Ni film and 10 nm-thick TiN film. After the formation of the NiSi by rapid thermal annealing (RTA) at 450 °C for 30 s, specific contact resistivity (ρc) between Ni-silicide and doped silicon region is extracted. There is a great reduction of the ρc, that is, from 9.84 × 10−5 Ω cm2 to 1.16 × 10−5 Ω·cm2 for n-Si and 6.24 × 10−5 Ω·cm2 to 1.84 × 10−5 Ω·cm2 for p-Si substrates, respectively. The improved interface morphology by introducing of Ho interlayer could be responsible for the ρc reduction.

Original languageEnglish
Article number111153
JournalMicroelectronic Engineering
Publication statusPublished - 2020 Jan 15

Bibliographical note

Publisher Copyright:
© 2019 Elsevier B.V.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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