Abstract
We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.
| Original language | English |
|---|---|
| Pages (from-to) | 18-23 |
| Number of pages | 6 |
| Journal | Journal of Semiconductor Technology and Science |
| Volume | 12 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2012 Mar |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering