TY - GEN
T1 - Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology
AU - Yi, Kyeongil
AU - Kim, Hyunsik
AU - Kim, Jaewhan
AU - Kim, Jikon
AU - Cho, Junghyun
AU - An, Kwangduk
AU - Kim, Shiho
PY - 2008
Y1 - 2008
N2 - We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.
AB - We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.
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U2 - 10.1109/EDAPS.2008.4736000
DO - 10.1109/EDAPS.2008.4736000
M3 - Conference contribution
AN - SCOPUS:60649116976
SN - 9781424426331
T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
SP - 65
EP - 68
BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
T2 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Y2 - 10 December 2008 through 12 December 2008
ER -