Abstract
Chip embedded flexible Packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50/Mn) are fabricated by chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel.
| Original language | English |
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| Pages | 844-847 |
| Number of pages | 4 |
| Publication status | Published - 2004 |
| Event | IEEE Sensors 2004 - Vienna, Austria Duration: 2004 Oct 24 → 2004 Oct 27 |
Other
| Other | IEEE Sensors 2004 |
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| Country/Territory | Austria |
| City | Vienna |
| Period | 04/10/24 → 04/10/27 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering