Hybrid copper complex-derived conductive patterns printed on polyimide substrates

Byoungyoon Lee, Sooncheol Jeong, Yoonhyun Kim, Inbum Jeong, Kyoohee Woo, Jooho Moon

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)


We synthesized new copper complexes that can be readily converted into highly conductive Cu film. Mechanochemical milling of copper (I) oxide suspended in formic acid resulted in the submicron-sized Cu formate together Cu nanoparticles. The submicrometer-sized Cu formates are reactive toward inter-particle sintering and metallic Cu seeds present in the Cu complexes assist their decomposition and the nucleation of Cu. The hybrid copper complex film printed on polyimide substrate is decomposed into dense and uniform Cu layer after annealing at 250 °C for 30 min under nitrogen atmosphere. The resulting Cu film exhibited a low resistivity of 8.2 μω·cm and good adhesion characteristics.

Original languageEnglish
Pages (from-to)493-498
Number of pages6
JournalMetals and Materials International
Issue number3
Publication statusPublished - 2012 Jun

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry


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