Highly stable 2D material (2DM) field-effect transistors (FETs) with wafer-scale multidyad encapsulation

Choong Ki Kim, Eun Gyo Jeong, Eungtaek Kim, Jeong Gyu Song, Youngjun Kim, Whang Je Woo, Myung Keun Lee, Hagyoul Bae, Seong Bae Jeon, Hyungjun Kim, Kyung Cheol Choi, Yang Kyu Choi

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3 Citations (Scopus)


Field-effect transistors (FETs) composed of 2D materials (2DMs) such as transition-metal dichalcogenide (TMD) materials show unstable electrical characteristics in ambient air due to the high sensitivity of 2DMs to water adsorbates. In this work, in order to demonstrate the long-term retention of electrical characteristics of a TMD FET, a multidyad encapsulation method was applied to a MoS2 FET and thereby its durability was warranted for one month. It was well known that the multidyad encapsulation method was effective to mitigate high sensitivity to ambient air in light-emitting diodes (LEDs) composed of organic materials. However, there was no attempt to check the feasibility of such a multidyad encapsulation method for 2DM FETs. It is timely to investigate the water vapor transmission ratio (WVTR) required for long-term stability of 2DM FETs. The 2DM FETs were fabricated with MoS2 flakes by both an exfoliation method, that is desirable to attain high quality film, and a chemical vapor deposition (CVD) method, that is applicable to fabrication for a large-sized substrate. In order to eliminate other unwanted variables, the MoS2 FETs composed of exfoliated flakes were primarily investigated to assure the effectiveness of the encapsulation method. The encapsulation method uses multiple dyads comprised of a polymer layer by spin coating and an Al2O3 layer deposited by atomic layer deposition (ALD). The proposed method shows wafer-scale uniformity, high transparency, and protective barrier properties against adsorbates (WVTR of 8 × 10-6 g m-2 day-1) over one month.

Original languageEnglish
Article number055203
Issue number5
Publication statusPublished - 2017 Feb 3

Bibliographical note

Funding Information:
This work was supported by the Center for Integrated Smart Sensors Project funded by the Ministry of Science, ICT & Future Planning as a Global Frontier Project (CISS-2011-0031848), by the Open Innovation Lab Project of the National Nanofab Center (NNFC), and by the IC Design Education Center (EDA Tool and MPW) in the Republic of Korea.

Publisher Copyright:
© 2016 IOP Publishing Ltd.

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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