Highly enhanced mechanical stability of indium tin oxide film with a thin Al buffer layer deposited on plastic substrate

Boyeon Sim; Eun He Kim; Jinwoo Park; Myeongkyu Lee

doi:10.1016/j.surfcoat.2009.07.028

Highly enhanced mechanical stability of indium tin oxide film with a thin Al buffer layer deposited on plastic substrate

Boyeon Sim, Eun He Kim, Jinwoo Park, Myeongkyu Lee

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

30 Citations (Scopus)

Abstract

We here report that the mechanical stability of indium tin oxide (ITO) film deposited on the plastic substrate can be highly enhanced by a thin metal buffer layer with a minimized loss of transparency. Neither cracks nor fragmentation was observed for a 75 nm-thick ITO film with a 5 nm-Al layer even after severe bending to a radius of curvature of 1.25 mm, while a 160 nm-ITO film of similar surface resistance was cracked at 9 mm. The improved crack resistance is accounted for by the fact that the effective elastic mismatch between the film and the substrate can be alleviated with a ductile buffer layer, thus the crack propagation is suppressed.

Original language	English
Pages (from-to)	309-312
Number of pages	4
Journal	Surface and Coatings Technology
Volume	204
Issue number	3
DOIs	https://doi.org/10.1016/j.surfcoat.2009.07.028
Publication status	Published - 2009 Oct 25

Bibliographical note

Funding Information:
This work was supported by the Korea Research Foundation Grant funded by the Korean government (MOEHRD) ( KRF-2008-314-D00207 ).

All Science Journal Classification (ASJC) codes

Chemistry(all)
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1016/j.surfcoat.2009.07.028

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abstract = "We here report that the mechanical stability of indium tin oxide (ITO) film deposited on the plastic substrate can be highly enhanced by a thin metal buffer layer with a minimized loss of transparency. Neither cracks nor fragmentation was observed for a 75 nm-thick ITO film with a 5 nm-Al layer even after severe bending to a radius of curvature of 1.25 mm, while a 160 nm-ITO film of similar surface resistance was cracked at 9 mm. The improved crack resistance is accounted for by the fact that the effective elastic mismatch between the film and the substrate can be alleviated with a ductile buffer layer, thus the crack propagation is suppressed.",

author = "Boyeon Sim and Kim, {Eun He} and Jinwoo Park and Myeongkyu Lee",

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T1 - Highly enhanced mechanical stability of indium tin oxide film with a thin Al buffer layer deposited on plastic substrate

AU - Sim, Boyeon

AU - Kim, Eun He

AU - Park, Jinwoo

AU - Lee, Myeongkyu

N1 - Funding Information: This work was supported by the Korea Research Foundation Grant funded by the Korean government (MOEHRD) ( KRF-2008-314-D00207 ).

PY - 2009/10/25

Y1 - 2009/10/25

N2 - We here report that the mechanical stability of indium tin oxide (ITO) film deposited on the plastic substrate can be highly enhanced by a thin metal buffer layer with a minimized loss of transparency. Neither cracks nor fragmentation was observed for a 75 nm-thick ITO film with a 5 nm-Al layer even after severe bending to a radius of curvature of 1.25 mm, while a 160 nm-ITO film of similar surface resistance was cracked at 9 mm. The improved crack resistance is accounted for by the fact that the effective elastic mismatch between the film and the substrate can be alleviated with a ductile buffer layer, thus the crack propagation is suppressed.

AB - We here report that the mechanical stability of indium tin oxide (ITO) film deposited on the plastic substrate can be highly enhanced by a thin metal buffer layer with a minimized loss of transparency. Neither cracks nor fragmentation was observed for a 75 nm-thick ITO film with a 5 nm-Al layer even after severe bending to a radius of curvature of 1.25 mm, while a 160 nm-ITO film of similar surface resistance was cracked at 9 mm. The improved crack resistance is accounted for by the fact that the effective elastic mismatch between the film and the substrate can be alleviated with a ductile buffer layer, thus the crack propagation is suppressed.

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Highly enhanced mechanical stability of indium tin oxide film with a thin Al buffer layer deposited on plastic substrate

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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