High-strength low-k glass–ceramic composite covers for 6G communication mobile devices

Ji Yeon Kim, Seok Won Choi, Kwan Sik Park, Yong yi Kim, Taehong Kim, Sang Bong Lee, Jongsu Lee, Seok Eun Kwon, Young Kook Lee, Do Kyun Kwon, Sang Jin Lee, Yong Soo Cho

Research output: Contribution to journalArticlepeer-review

Abstract

Ceramic-based back covers are commercially utilized as a high-end option for the physical protection of mobile phones. Herein, an unprecedented composite structure consisting of a cordierite (2MgO.2Al2O3[rad]5SiO2) glass–ceramic strengthened with yttria-stabilized zirconia (YSZ) fillers is introduced as a protective back cover, specifically for next-generation communication mobile phones additionally requiring a low dielectric constant at gigahertz frequencies. Crystallization sequence was rather complicated with the involvements of multiple crystalline phases, α- and μ-cordierite, tetragonal and monoclinic ZrO2, and ZrSiO4, depending on the glass and composite compositions. This unique approach effectively induced the best mechanical performance for the 10 wt% YSZ/glass–ceramic structure, despite the low sintering temperature of 1050 °C, with the highest Vickers hardness of ∼9.2 GPa and flexural strength of ∼196.8 MPa attained for the optimal composite. Although effective dielectric constant of the composites depended on the relative contents of the evolved crystalline phases, overall dielectric constant was kept low due to the utilization of cordierite glass as the main component.

Original languageEnglish
Pages (from-to)35725-35733
Number of pages9
JournalCeramics International
Volume50
Issue number19
DOIs
Publication statusPublished - 2024 Oct 1

Bibliographical note

Publisher Copyright:
© 2024 Elsevier Ltd and Techna Group S.r.l.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Materials Chemistry

Fingerprint

Dive into the research topics of 'High-strength low-k glass–ceramic composite covers for 6G communication mobile devices'. Together they form a unique fingerprint.

Cite this