Abstract
This paper presents silicon-on-insulation (SOI) CMOS T/R and SP4T switches with high-power handling capability. The CMOS transistors are stacked and their sources and drains are biased for the high-power handling capability. The TQ trench of 0.18-μm SOI CMOS process is properly placed to improve the substrate isolation between transistors. For the T/R switch, the measured insertion loss of Tx and Rx modes are <1.1 and<1.7 dB, respectively, in Ku-band (12–18 GHz). The measured isolation between Tx and Rx ports is>24 dB in the same frequency band. To author’s knowledge, this T/R switch shows the highest input 1-dB compression point of 34 dBm in Ku-band CMOS switches. The SP4T switch operates in DC-18 GHz, and the measured insertion loss and isolation are <2.4 and >19.5 dB, respectively, with the return loss of < –9.3 dB. This chip sizes are 0.11 mm2 for the T/R switch and 0.12 mm2 for the SP4T switch.
Original language | English |
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Pages (from-to) | 728-739 |
Number of pages | 12 |
Journal | Journal of Electromagnetic Waves and Applications |
Volume | 30 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2016 Apr 12 |
Bibliographical note
Publisher Copyright:© 2016 Informa UK Limited, trading as Taylor & Francis Group.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Electrical and Electronic Engineering