Abstract
We experimentally demonstrated high performance and self-rectifying hafnia based ferroelectric tunnel junction (FTJ) using stress engineering, diffusion barrier technology, and imprint field effect for neuromorphic computing and logic in memory application. In TiN/HZO/TaN/W stacked FTJ, W bottom electrode which has low thermal expansion coefficient enables to stabilize the ferroelectric o-phase even at ultra-thin HZO film, and TaN layer suppresses the diffusion of W atoms into ferroelectric HZO layer, resulting in reduction of leakage current and giant TER value of 100. In addition, highly asymmetric switching characteristics with rectifying ratio of 1000 is achieved using imprint field effect induced by positive fixed charges nearby bottom interface. The proposed device provides a viable solution for high performance, low power and high-density synaptic devices and TCAM applications.
Original language | English |
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Title of host publication | 2021 IEEE International Electron Devices Meeting, IEDM 2021 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 17.2.1-17.2.4 |
ISBN (Electronic) | 9781665425728 |
DOIs | |
Publication status | Published - 2021 |
Event | 2021 IEEE International Electron Devices Meeting, IEDM 2021 - San Francisco, United States Duration: 2021 Dec 11 → 2021 Dec 16 |
Publication series
Name | Technical Digest - International Electron Devices Meeting, IEDM |
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Volume | 2021-December |
ISSN (Print) | 0163-1918 |
Conference
Conference | 2021 IEEE International Electron Devices Meeting, IEDM 2021 |
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Country/Territory | United States |
City | San Francisco |
Period | 21/12/11 → 21/12/16 |
Bibliographical note
Publisher Copyright:© 2021 IEEE.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry