Abstract
As the number and complexity of wireless applications grow, there is increasing need for circuits designed to operate at high frequencies, i.e., in the RF and microwave frequency range for audio, video, and data transmission. In particular, circuit materials with a high dielectric constant (k > 15) have been required to reduce device size and/or increase capacitance density. Low temperature co-fired ceramic (LTCC) tape is a well-known technology for combining a high conductivity metallization with reliable ceramic dielectric layers for low temperature processing and dense packaging. This work deals with a new high k LTCC system (EC002 tape) compatible with existing lower k LTCC tapes such as 951 and 943 Green Tape™ and capable of operation in the GHz frequency range. The characteristics of this new tape, which include tape shrinkage, silver metallization, and high frequency electrical properties, will be discussed with emphasis on its compatibility and integrity with other LTCC systems.
| Original language | English |
|---|---|
| Pages (from-to) | 195-199 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 5231 |
| Publication status | Published - 2003 |
| Event | Ceramic Interconnect Technology: The Next Generation - Denver, CO, United States Duration: 2003 Apr 7 → 2003 Apr 9 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering