Herringbone-Based TSV Architecture for Clustered Fault Repair and Aging Recovery

Sangmin Park, Minho Cheong, Donghyun Han, Sungho Kang

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


Three-dimensional integrated circuits (3-D ICs) utilizing through-silicon via (TSV) technology have many advantages over 2-D ICs, including high bandwidth, high density, and low power consumption. However, TSV, which is a key feature of 3-D ICs, has not only problems due to defects in the manufacturing process but also potential problems due to aging. Various solutions have been proposed to address each of these issues, but no one solution has been proposed considering both. In practice, to improve the overall reliability of the TSV, the two problems should be solved together, not separately. In this article, a new TSV architecture is proposed to cope with both issues. The proposed TSV architecture uses redundant TSVs (RTSVs) to repair faulty TSVs due to manufacturing defects and uses unused RTSVs in this way to solve the aging-related problems. Experimental results show that the proposed architecture achieves similar repair rate with less than 1% difference in less than six clustered faults using smaller hardware overhead, and also shows that unused RTSVs are available with a 98.5% high probability, resulting in a 1.5 times improvement in lifetime.

Original languageEnglish
Pages (from-to)1142-1153
Number of pages12
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Issue number4
Publication statusPublished - 2022 Apr 1

Bibliographical note

Publisher Copyright:
© 1982-2012 IEEE.

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering


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