Graphene-based heat spreader for flexible electronic devices

Sang Hoon Bae, Roxana Shabani, Jae Bok Lee, Seung Jae Baeck, Hyoung Jin Cho, Jong Hyun Ahn

Research output: Contribution to journalArticlepeer-review

33 Citations (Scopus)


Graphene known for its superb physical properties, such as high transparency and thermal conductivity, is proposed as a solution to the problem of thermal management of the electronic devices, requiring transparency and cooling. It is shown that graphene heat spreader layer drives the heat out of the device more efficiently as compared with the commercially used metal thin films for integrated circuit cooling. An application of graphene heat spreader is proposed and tested in chip-on-film packaging. Graphene performance is compared with a gold layer with a similar transparency experimentally and theoretically as a proof of the efficient thermal management capability of graphene.

Original languageEnglish
Article number6952998
Pages (from-to)4171-4175
Number of pages5
JournalIEEE Transactions on Electron Devices
Issue number12
Publication statusPublished - 2014 Dec 1

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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