Function-inspection scheme for an injured peripheral nerve using a polymer based microelectrode array

Yong Ho Kim, Chungkeun Lee, Kang Min Ahn, Yong Jun Kim, Myoungho Lee

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

This paper presents a compound nerve action potential (CNAP) monitoring system of a peripheral nerve which is composed of a sieve-shape flexible microelectrode array (MEA), a polyglycolic acid (PGA) conduit and a bio-potential amplifier. The system observes a regenerated peripheral nerve by measuring its CNAP. An MEA is fabricated through micromachining technology, and its interfacial impedance (420 kΩ/μm2) and signal transfer characteristics were analyzed. The fabricated MEA was assembled with the PGA conduit, and then the assembly had been implanted into a sciatic nerve of a rat. After 12 week-implantation periods, regenerated state of the damaged sciatic nerve was investigated by gait analysis and CNAP measurement. From the gait analysis, sciatic function index (SFI) was calculated to be -48.5 ± 15.0. According to the CNAP measurement, threshold potential was 250 μV in contrast to 110 μV for a normal nerve. After the functional tests, regenerated nerves were harvested and their morphologies were examined through toluidine blue (TB), Hematoxylin and Eosin (H&E) and transmission electron microscope (TEM) images. According to the morphology study, it was confirmed that proximal and distal nerve stump showed similar morphology and axon number.

Original languageEnglish
Pages (from-to)58-65
Number of pages8
JournalSensors and Actuators, A: Physical
Volume139
Issue number1-2 SPEC. ISS.
DOIs
Publication statusPublished - 2007 Sept 12

Bibliographical note

Funding Information:
This work is supported in part by MIC & IITA through IT Leading R&D Support Project (Project No. 2005-S-093-02).

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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