Fully packaged finite-ground coplanar line-to-micromachined waveguide transition

James P. Becker; Yongshik Lee; Jack R. East; Linda P.B. Katehi

Fully packaged finite-ground coplanar line-to-micromachined waveguide transition

James P. Becker, Yongshik Lee, Jack R. East, Linda P.B. Katehi

Department of Electrical and Electronic Engineering

Research output: Contribution to conference › Paper › peer-review

2 Citations (Scopus)

Abstract

A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart.

Original language	English
Pages	273-276
Number of pages	4
Publication status	Published - 2000
Event	9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA Duration: 2000 Oct 23 → 2000 Oct 25

Other

Other	9th Topical Meeting on Electrical Performance of Electronic Packaging
City	Scottsdale, AZ, USA
Period	00/10/23 → 00/10/25

All Science Journal Classification (ASJC) codes

Engineering(all)

Cite this

@conference{a31d24925c36442e94ffd5711058033e,

title = "Fully packaged finite-ground coplanar line-to-micromachined waveguide transition",

abstract = "A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart.",

author = "Becker, {James P.} and Yongshik Lee and East, {Jack R.} and Katehi, {Linda P.B.}",

year = "2000",

language = "English",

pages = "273--276",

note = "9th Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 23-10-2000 Through 25-10-2000",

}

TY - CONF

T1 - Fully packaged finite-ground coplanar line-to-micromachined waveguide transition

AU - Becker, James P.

AU - Lee, Yongshik

AU - East, Jack R.

AU - Katehi, Linda P.B.

PY - 2000

Y1 - 2000

N2 - A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart.

AB - A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart.

UR - http://www.scopus.com/inward/record.url?scp=0034513861&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034513861&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0034513861

SP - 273

EP - 276

T2 - 9th Topical Meeting on Electrical Performance of Electronic Packaging

Y2 - 23 October 2000 through 25 October 2000

ER -

Fully packaged finite-ground coplanar line-to-micromachined waveguide transition

Abstract

Other

All Science Journal Classification (ASJC) codes

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