FRESH: A New Test Result Extraction Scheme for Fast TSV Tests

Jaeseok Park, Hyunyul Lim, Sungho Kang

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


Three-dimensional integrated circuits (3-D ICs) are considered to meet the performance needs of future ICs. The core components of 3-D ICs are through-silicon vias (TSVs), which should pass appropriate prebond and post-bond tests in 3-D IC fabrication processes. The test inputs must be injected into the TSVs, and the test results must be extracted. This paper proposes a new test result extraction scheme [fast result extraction by selective shift-out (FRESH)] for prebond and post-bond TSV testing. With additional hardware, the proposed scheme remarkably reduces the TSV test time. FRESH avoids unnecessary test result extraction when the number of faulty TSVs in the TSV set is 0 or exceeds the number of TSV redundancies in the set. These early fault analyses are executed in the checkers of TSV groups. The experimental results show that the proposed scheme can reduce the result extraction time in practical environments.

Original languageEnglish
Article number7488276
Pages (from-to)336-345
Number of pages10
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Issue number2
Publication statusPublished - 2017 Feb

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering


Dive into the research topics of 'FRESH: A New Test Result Extraction Scheme for Fast TSV Tests'. Together they form a unique fingerprint.

Cite this