Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

Sun Il Chang; Hyung Kew Lee; Euisik Yoon

Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

Sun Il Chang, Hyung Kew Lee, Euisik Yoon

Yonsei Advanced Science Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this paper, we have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (Anisotropic Conductive Paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.

Original language	English
Title of host publication	TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages	1969-1972
Number of pages	4
Publication status	Published - 2005
Event	13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of Duration: 2005 Jun 5 → 2005 Jun 9

Publication series

Name	Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume	2

Other

Other	13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Country/Territory	Korea, Republic of
City	Seoul
Period	05/6/5 → 05/6/9

All Science Journal Classification (ASJC) codes

Engineering(all)

Cite this

Chang, S. I., Lee, H. K., & Yoon, E. (2005). Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. In TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers (pp. 1969-1972). Article 4B1.2 (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05; Vol. 2).

Chang, Sun Il ; Lee, Hyung Kew ; Yoon, Euisik. / Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers. 2005. pp. 1969-1972 (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05).

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title = "Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array",

abstract = "In this paper, we have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (Anisotropic Conductive Paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.",

author = "Chang, {Sun Il} and Lee, {Hyung Kew} and Euisik Yoon",

year = "2005",

language = "English",

isbn = "0780389948",

series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",

pages = "1969--1972",

booktitle = "TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers",

note = "13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 ; Conference date: 05-06-2005 Through 09-06-2005",

}

Chang, SI, Lee, HK & Yoon, E 2005, Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. in TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers., 4B1.2, Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05, vol. 2, pp. 1969-1972, 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05, Seoul, Korea, Republic of, 05/6/5.

Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. / Chang, Sun Il; Lee, Hyung Kew; Yoon, Euisik.
TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers. 2005. p. 1969-1972 4B1.2 (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

AU - Chang, Sun Il

AU - Lee, Hyung Kew

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PY - 2005

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N2 - In this paper, we have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (Anisotropic Conductive Paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.

AB - In this paper, we have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (Anisotropic Conductive Paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.

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M3 - Conference contribution

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T3 - Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

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T2 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Y2 - 5 June 2005 through 9 June 2005

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Chang SI, Lee HK, Yoon E. Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. In TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers. 2005. p. 1969-1972. 4B1.2. (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05).

Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

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