Flexible wireless pressure sensor module

Kyu Ho Shin, Chang Ryoul Moon, Tae Hee Lee, Chang Hyun Lim, Yong Jun Kim

Research output: Contribution to journalArticlepeer-review

39 Citations (Scopus)


A flexible wireless pressure sensor module for implantable blood pressure sensing has been developed using chip embedded flexible packaging (CEFP) technology. The CEFP can provide wireless communication platform, which is composed of thinned silicon chips (RFIC) and antenna. The mechanical characteristics of the thinned silicon chips for flexible communication platform are analyzed using a bending test and computer simulation. The realized sensor is mechanically flexible and can be easily attached to the outside of the blood vessel. The pressure sensor consists of a flexible capacitance type sensor system including LC resonator, which is wrapped onto the blood vessel and can remotely monitor the blood pressure. As blood pressure changes, the blood vessel either expands or shrinks. The sensor system recognizes blood pressure variation due to changing the distance between the electrodes and hence, capacitance. While the applied pressure changes from 0 to 213.3 kPa the resonator frequency changes correspondingly. The sensitivity of the implantable blood pressure is 11.25 kHz/kPa. The proposed flexible wireless sensor module can be used as a basic platform in a ubiquitous sensor network system.

Original languageEnglish
Pages (from-to)30-35
Number of pages6
JournalSensors and Actuators, A: Physical
Publication statusPublished - 2005 Sept 23

Bibliographical note

Funding Information:
This research was supported by the Ministry of Information and Communication (MIC), Korea, under the Information Technology Research Center (ITRC) support program supervised by the Institute of Information Technology Assessment (IITA).

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering


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