TY - GEN
T1 - Flexible Water-proof Bio-Integrated Electronics
AU - Sang, Mingyu
AU - Yu, Ki Jun
PY - 2019/3
Y1 - 2019/3
N2 - Due to the absence of thin-film barriers to biofluids with multidecade lifetimes, the penetration of biofluids into the devices and any ensuing electrochemical reactions pose significant safety risks. Here, we overcome these challenges by combining pristine thermal SiO2 layers with processing steps for their integration onto flexible electronics. We showed that an ultrathin, leakage-free, biocompatible dielectric layer which can completely seal the device. The resulting current-leakage levels and operational lifetimes have been improved significantly.
AB - Due to the absence of thin-film barriers to biofluids with multidecade lifetimes, the penetration of biofluids into the devices and any ensuing electrochemical reactions pose significant safety risks. Here, we overcome these challenges by combining pristine thermal SiO2 layers with processing steps for their integration onto flexible electronics. We showed that an ultrathin, leakage-free, biocompatible dielectric layer which can completely seal the device. The resulting current-leakage levels and operational lifetimes have been improved significantly.
UR - http://www.scopus.com/inward/record.url?scp=85067797191&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067797191&partnerID=8YFLogxK
U2 - 10.1109/EDTM.2019.8731044
DO - 10.1109/EDTM.2019.8731044
M3 - Conference contribution
T3 - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
SP - 16
EP - 19
BT - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
Y2 - 12 March 2019 through 15 March 2019
ER -