Abstract
A flexible polysilicon strain gauge array has been realized using a surface micromachining technique with a SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on non-planar surfaces. To realize the flexible strain gauge module, a new packaging scheme using a polyimide circuit board and an oxide based surface-micromachining was developed. The proposed packaging scheme completes the strain sensors and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than metal strain gauges. Unlike a single-crystal silicon strain gauge, the proposed polysilicon gauge has no limitations in the direction of strain.
Original language | English |
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Pages (from-to) | L810-L813 |
Journal | Japanese Journal of Applied Physics |
Volume | 42 |
Issue number | 7 B |
DOIs | |
Publication status | Published - 2003 Jul 15 |
All Science Journal Classification (ASJC) codes
- Engineering(all)
- Physics and Astronomy(all)