Flexible and embedded packaging of thinned silicon chip

Engineering

• Flexible Substrate 66%
• Passive Component 33%
• Bending Tests 33%
• Active Device 33%
• Single Device 33%
• Size System 33%
• Flexible Package 33%
• Applications 33%
• Characteristics 33%
• Density 33%
• Bends 33%
• Modules 33%
• Integration 33%

Computer Science

• Packaging Technology 100%
• Passive Component 33%
• Application 33%
• Functions 33%
• System Analysis 33%

Physics

• Silicon 66%
• Systems Integration 33%
• Utilization 33%
• Increasing 33%
• Finite Element Methods 33%