Abstract
Coupling between microstrip lines in dense RF packages is a common problem that degrades the circuit performance. To help alleviate this problem, metal filled via hole fences may be placed on both sides of the microstrip to provide better field confinement. In this paper, a 3D-FEM electromagnetic simulation of the problem is presented and it is shown that a single role of vias provides no reduction in the crosstalk. However, by connecting the tops of the vias with a single metal strip, the crosstalk may be reduced by 8-10 dB.
| Original language | English |
|---|---|
| Pages (from-to) | 185-189 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3582 |
| Publication status | Published - 1998 |
| Event | Proceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA Duration: 1998 Nov 1 → 1998 Nov 4 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering