Fabrication and thermal analysis of wafer-level light-emitting diode packages

Jeung Mo Kang; Jeong Hyeon Choi; Du Hyun Kim; Jae Wook Kim; Yong Seon Song; Geun Ho Kim; Sang Kook Han

doi:10.1109/LED.2008.2002749

Fabrication and thermal analysis of wafer-level light-emitting diode packages

Jeung Mo Kang, Jeong Hyeon Choi, Du Hyun Kim, Jae Wook Kim, Yong Seon Song, Geun Ho Kim, Sang Kook Han

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

26 Citations (Scopus)

Abstract

Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.

Original language	English
Pages (from-to)	1118-1120
Number of pages	3
Journal	IEEE Electron Device Letters
Volume	29
Issue number	10
DOIs	https://doi.org/10.1109/LED.2008.2002749
Publication status	Published - 2008

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/LED.2008.2002749

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abstract = "Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.",

author = "Kang, {Jeung Mo} and Choi, {Jeong Hyeon} and Kim, {Du Hyun} and Kim, {Jae Wook} and Song, {Yong Seon} and Kim, {Geun Ho} and Han, {Sang Kook}",

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AU - Choi, Jeong Hyeon

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AU - Kim, Jae Wook

AU - Song, Yong Seon

AU - Kim, Geun Ho

AU - Han, Sang Kook

PY - 2008

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AB - Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.

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Fabrication and thermal analysis of wafer-level light-emitting diode packages

Abstract

All Science Journal Classification (ASJC) codes

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