Extension of the T-bridge method for measuring the thermal conductivity of two-dimensional materials

In this paper, the T-bridge method is extended to measure the thermal properties of two-dimensional nanomaterials. We present an analysis of the measureable positions, width, and thermal resistance of two-dimensional materials. For verification purposes, the thermal conductivity of a SiO₂ nanoribbon was measured. To enhance the thermal contact between the nanoribbon and the heater in the setup, the nanoribbon was dipped into either isopropanol or water in order to promote a sticking force. Also, focused ion beam deposition was used to deposit the nanoribbon onto the contact. The thermal conductivities of all three cases were identical, showing that water dipping could be used to enhance the thermal contact. Due to the simple structure of this method and the analysis provided herein, the T-bridge method can be widely used for measuring the thermal conductivity of two-dimensional materials.