Abstract
Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.
| Original language | English |
|---|---|
| Pages (from-to) | 76-80 |
| Number of pages | 5 |
| Journal | IEEE Transactions on Advanced Packaging |
| Volume | 24 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2001 Feb |
Bibliographical note
Funding Information:Manuscript received December 20, 1999; revised November 16, 2000. This work was supported by NASA Glenn Research Center, the University of Michigan Center for Parallel Computing, NSF Grant CDA-92-14296, the Ford Motor Company, and Dielectric Laboratories, Inc. G. E. Ponchak is with the Electron Devices Technology Branch, NASA Glenn Research Center, Cleveland, OH 44135 USA. D. Chun and L. P. B. Katehi are with the Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109–2122 USA. J.-W. Yook is with the Department of Information and Communications, Kwang-Ju Institute of Science and Technology, Kwang-Ju 500-712, Korea. Publisher Item Identifier S 1521-3323(01)02415-7.
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering