Experimental analysis of bifilar pancake type fault current limiting coil using stabilizer-free coated conductor

Jin Bae Na, Dong Keun Park, Seong Eun Yang, Young Jae Kim, Ki Sung Chang, Hyoungku Kang, Tae Kuk Ko

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

YBCO coated conductors (CC) have actively been researched and manufactured these days. Recently, stabilizer-free (SF) CC with Hastelloy substrate has been developed for superconducting fault current limiter (SFCL). The SF CC has higher resistivity than other existing CCs with thick metallic stabilizer. Higher voltage per unit length applicable can be increased. In this research, the bifilar pancake coil using SF CC was manufactured and characteristic tests of the coil for SFCL were performed. Though the bifilar coil is supposed to have no inductance during normal operation, the transport current loss is be produced due to AC current flowing through the SF CC. AC loss was measured and short-circuit test was performed in liquid nitrogen. In order to develop large scale SFCL, it is indispensable to consider the dielectric characteristics of pancake module. Dielectric breakdown tests were carried out to find applicable maximum voltage in one pancake module. These results provided to suitable design parameters and showed technical feasibility of pancake type module as an SFCL.

Original languageEnglish
Article number5067275
Pages (from-to)1797-1800
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume19
Issue number3
DOIs
Publication statusPublished - 2009 Jun

Bibliographical note

Funding Information:
Manuscript received August 26, 2008. First published June 05, 2009; current version published July 15, 2009. This work was supported by a grant from the Center for Applied Superconductivity Technology of the 21st century Frontier R&D Program funded by the Ministry of Science and Technology, Republic of Korea.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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