Enhanced thermal stability of Bi2Te3-based alloys via interface engineering with atomic layer deposition

Sang Soon Lim, Kwang Chon Kim, Hansol Jeon, Ju Young Kim, Jun Yun Kang, Hyung Ho Park, Seung Hyub Baek, Jin Sang Kim, Seong Keun Kim

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

The ease of Te sublimation from Bi2Te3-based alloys significantly deteriorates thermoelectric and mechanical properties via the formation of voids. We propose a novel strategy based on atomic layer deposition (ALD) to improve the thermal stability of Bi2Te3-based alloys via the encapsulation of grains with a ZnO layer. Only a few cycles of ZnO ALD over the Bi2Te2.7Se0.3 powders resulted in significant suppression of the generation of pores in Bi2Te2.7Se0.3 extrudates and increased the density even after post-annealing at 500 °C. This is attributed to the suppression of Te sublimation from the extrudates. The ALD coating also enhanced grain refinement in Bi2Te2.7Se0.3 extrudates. Consequently, their mechanical properties were significantly improved by the encapsulation approach. Furthermore, the ALD approach yields a substantial improvement in the figure-of-merit after the post-annealing. Therefore, we believe the proposed approach using ALD will be useful for enhancing the mechanical properties of Bi2Te3-based alloys without sacrificing thermoelectric performance.

Original languageEnglish
Pages (from-to)3592-3599
Number of pages8
JournalJournal of the European Ceramic Society
Volume40
Issue number10
DOIs
Publication statusPublished - 2020 Aug

Bibliographical note

Publisher Copyright:
© 2020 Elsevier Ltd

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Fingerprint

Dive into the research topics of 'Enhanced thermal stability of Bi2Te3-based alloys via interface engineering with atomic layer deposition'. Together they form a unique fingerprint.

Cite this