Abstract
The characteristics of resistive switching of TiN/HfO2/Ti/ HfO2/Pt/Ti stacks on SiO2/Si substrates were investigated and compared to TiN/HfO2/Pt/Ti stacks in order to study Ti interlayer effects on resistive switching. The Ti interlayers were deposited in situ during the reactive sputtering of HfO2 films. The current-voltage measurements showed that the Ti interlayers enhanced the memory window but reduced the endurance of SET/RESET operations. The energy filtered images by TEM showed asymmetric oxygen accumulation at the Ti/HfOx interfaces. Subsequent heat treatment improved the endurance of SET/RESET operation of TiN/HfO2/Ti/HfO2/Pt/Ti stacks.
Original language | English |
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Pages (from-to) | 997-1001 |
Number of pages | 5 |
Journal | Applied Physics A: Materials Science and Processing |
Volume | 102 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2011 Mar |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Materials Science(all)