TY - GEN
T1 - Enhanced algorithm of combining trace and scan signals in post-silicon validation
AU - Han, Kihyuk
AU - Yang, Joon Sung
AU - Abraham, Jacob A.
PY - 2013
Y1 - 2013
N2 - As the complexity of integrated circuit design increases and production schedules become shorter, the dependency on post-silicon validation for capturing design errors that escape from pre-silicon verification also increases. A major challenge in post-silicon validation is the limited observability of internal states caused by the limited storage capacity available for post-silicon validation. Recent research has shown that observability can be enhanced if trace and scan signals are combined together, compared with the debugging scenario where only trace signals are monitored. This paper proposes an enhanced and systematic algorithm for the efficient combination of trace and scan signals to maximize the observability of internal circuit states. Experimental results on benchmark circuits show that the proposed technique provides a higher number of restored states compared to the existing techniques.
AB - As the complexity of integrated circuit design increases and production schedules become shorter, the dependency on post-silicon validation for capturing design errors that escape from pre-silicon verification also increases. A major challenge in post-silicon validation is the limited observability of internal states caused by the limited storage capacity available for post-silicon validation. Recent research has shown that observability can be enhanced if trace and scan signals are combined together, compared with the debugging scenario where only trace signals are monitored. This paper proposes an enhanced and systematic algorithm for the efficient combination of trace and scan signals to maximize the observability of internal circuit states. Experimental results on benchmark circuits show that the proposed technique provides a higher number of restored states compared to the existing techniques.
UR - http://www.scopus.com/inward/record.url?scp=84881279641&partnerID=8YFLogxK
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U2 - 10.1109/VTS.2013.6548915
DO - 10.1109/VTS.2013.6548915
M3 - Conference contribution
AN - SCOPUS:84881279641
SN - 9781467355438
T3 - Proceedings of the IEEE VLSI Test Symposium
BT - Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013
T2 - 2013 IEEE 31st VLSI Test Symposium, VTS 2013
Y2 - 29 April 2013 through 1 May 2013
ER -