Encapsulation of the micromachined air-suspended inductors

Yun Seok Choi, Euisik Yoon, Jun Bo Yoon

Research output: Contribution to journalConference articlepeer-review

7 Citations (Scopus)


We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.

Original languageEnglish
Pages (from-to)1637-1640
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Publication statusPublished - 2003
Event2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States
Duration: 2003 Jun 82003 Jun 13

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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