Effects of catalyst accelerator on electromagnetic shielding in nonelectrolytic Cu-plated fabrics

E. A. Kim; E. G. Han; K. W. Oh; J. G. Na

doi:10.1063/1.373223

Effects of catalyst accelerator on electromagnetic shielding in nonelectrolytic Cu-plated fabrics

E. A. Kim, E. G. Han, K. W. Oh, J. G. Na

Department of Clothing and Textiles

Research output: Contribution to journal › Conference article › peer-review

30 Citations (Scopus)

Abstract

The effects of etching and catalyst accelerating conditions on microstructures of copper films and electromagnetic interference (EMI) shielding effectiveness (SE) of nonelectrolytic copper-plated fabrics were investigated. Copper films were coated onto polyester fabrics by a conventional nonelectrolytic copper plating process. Comparison of two etchants had the result where uniform deposition of Cu particles in the smaller size was observed using acidic etchant, which provided the better EMI SE than alkaline etchant. We found that KCl was the better catalyst accelerator than commonly used SnCl₂. EMI SEs and conductivities of copper-plated fabrics increased as the concentration of KCl increased up to 0.1 mole/1 and then decreased with further addition.

Original language	English
Pages (from-to)	4984-4986
Number of pages	3
Journal	Journal of Applied Physics
Volume	87
Issue number	9 II
DOIs	https://doi.org/10.1063/1.373223
Publication status	Published - 2000 May
Event	44th Annual Conference on Magnetism and Magnetic Materials - San Jose, CA, United States Duration: 1999 Nov 15 → 1999 Nov 18

All Science Journal Classification (ASJC) codes

Physics and Astronomy(all)

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10.1063/1.373223

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title = "Effects of catalyst accelerator on electromagnetic shielding in nonelectrolytic Cu-plated fabrics",

abstract = "The effects of etching and catalyst accelerating conditions on microstructures of copper films and electromagnetic interference (EMI) shielding effectiveness (SE) of nonelectrolytic copper-plated fabrics were investigated. Copper films were coated onto polyester fabrics by a conventional nonelectrolytic copper plating process. Comparison of two etchants had the result where uniform deposition of Cu particles in the smaller size was observed using acidic etchant, which provided the better EMI SE than alkaline etchant. We found that KCl was the better catalyst accelerator than commonly used SnCl2. EMI SEs and conductivities of copper-plated fabrics increased as the concentration of KCl increased up to 0.1 mole/1 and then decreased with further addition.",

author = "Kim, {E. A.} and Han, {E. G.} and Oh, {K. W.} and Na, {J. G.}",

year = "2000",

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issn = "0021-8979",

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note = "44th Annual Conference on Magnetism and Magnetic Materials ; Conference date: 15-11-1999 Through 18-11-1999",

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TY - JOUR

T1 - Effects of catalyst accelerator on electromagnetic shielding in nonelectrolytic Cu-plated fabrics

AU - Kim, E. A.

AU - Han, E. G.

AU - Oh, K. W.

AU - Na, J. G.

PY - 2000/5

Y1 - 2000/5

N2 - The effects of etching and catalyst accelerating conditions on microstructures of copper films and electromagnetic interference (EMI) shielding effectiveness (SE) of nonelectrolytic copper-plated fabrics were investigated. Copper films were coated onto polyester fabrics by a conventional nonelectrolytic copper plating process. Comparison of two etchants had the result where uniform deposition of Cu particles in the smaller size was observed using acidic etchant, which provided the better EMI SE than alkaline etchant. We found that KCl was the better catalyst accelerator than commonly used SnCl2. EMI SEs and conductivities of copper-plated fabrics increased as the concentration of KCl increased up to 0.1 mole/1 and then decreased with further addition.

AB - The effects of etching and catalyst accelerating conditions on microstructures of copper films and electromagnetic interference (EMI) shielding effectiveness (SE) of nonelectrolytic copper-plated fabrics were investigated. Copper films were coated onto polyester fabrics by a conventional nonelectrolytic copper plating process. Comparison of two etchants had the result where uniform deposition of Cu particles in the smaller size was observed using acidic etchant, which provided the better EMI SE than alkaline etchant. We found that KCl was the better catalyst accelerator than commonly used SnCl2. EMI SEs and conductivities of copper-plated fabrics increased as the concentration of KCl increased up to 0.1 mole/1 and then decreased with further addition.

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VL - 87

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JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 9 II

T2 - 44th Annual Conference on Magnetism and Magnetic Materials

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Effects of catalyst accelerator on electromagnetic shielding in nonelectrolytic Cu-plated fabrics

Abstract

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