TY - GEN
T1 - Effect of oxygen diffusion into TiN on resistance switching characteristics of ZrO2 films with annealing temperatures
AU - Kim, Jonggi
AU - Lee, Sunghoon
AU - Na, Heedo
AU - Lee, Kyumin
AU - Sohn, Hyunchu
PY - 2011
Y1 - 2011
N2 - In this study, the effects of annealing temperature on both physical and resistive switching properties of ZrO2 films were investigated. XRD showed the increase of the monoclinic phase in the as-grown tetragonal ZrO 2 with annealing above 450C. The ZrO2 films exhibited the unipolar and the bipolar switching behaviors in Pt/ZrO2/TiN MIM structure. The HRS resistance in unipolar switching behavior was reduced with increasing annealing temperature. On the contrary, The HRS resistance in bipolar switching behavior was increased. XPS showed the increase of metallic Zr in annealed ZrO2 films that could cause the reduction of HRS resistance in unipolar resistance switching of ZrO2. SIMS spectra confirmed the enlargement of interfacial TiOxNy layer in TiN bottom electrode with increasing the annealing temperature. The enlargement of interfacial TiOxNy layer was expected to cause an increase of HRS resistance because the larger amount of mobile oxygen ions in inter-facial TiOxNy layer was possible to migrate to ZrO2-x films.
AB - In this study, the effects of annealing temperature on both physical and resistive switching properties of ZrO2 films were investigated. XRD showed the increase of the monoclinic phase in the as-grown tetragonal ZrO 2 with annealing above 450C. The ZrO2 films exhibited the unipolar and the bipolar switching behaviors in Pt/ZrO2/TiN MIM structure. The HRS resistance in unipolar switching behavior was reduced with increasing annealing temperature. On the contrary, The HRS resistance in bipolar switching behavior was increased. XPS showed the increase of metallic Zr in annealed ZrO2 films that could cause the reduction of HRS resistance in unipolar resistance switching of ZrO2. SIMS spectra confirmed the enlargement of interfacial TiOxNy layer in TiN bottom electrode with increasing the annealing temperature. The enlargement of interfacial TiOxNy layer was expected to cause an increase of HRS resistance because the larger amount of mobile oxygen ions in inter-facial TiOxNy layer was possible to migrate to ZrO2-x films.
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U2 - 10.1109/IITC.2011.5940347
DO - 10.1109/IITC.2011.5940347
M3 - Conference contribution
AN - SCOPUS:80052054593
SN - 9781457705038
T3 - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011
BT - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011
T2 - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011
Y2 - 8 May 2011 through 12 May 2011
ER -