TY - JOUR
T1 - Effect of carboxylic acid on sintering of inkjet-printed copper nanoparticulate films
AU - Woo, Kyoohee
AU - Kim, Youngwoo
AU - Lee, Byungyoon
AU - Kim, Jonghee
AU - Moon, Jooho
PY - 2011/7/27
Y1 - 2011/7/27
N2 - The reduction effect of various carboxylic acids on inkjet-printed copper film was investigated. Carboxylic acids were exposed to the film by nitrogen gas that was bubbled through the liquid acids during the annealing process. It was observed that in the case of saturated monocarboxylic acid (formic, acetic, propionic, butyric), the acids with shorter hydrocarbon chains perform better in reducing the surface copper oxides in the printed copper conductive film. The printed films exposed to formic acid vapor exhibited the lowest resistivity (3.10 and 2.30 μω cm when annealed at 200 and 250 °C, respectively). In addition, the oxalic acid more effectively reduces copper oxide than formic acid and its usage can shorten the annealing time for highly conductive printed copper film. This reductive annealing process allows fabrication of copper patterns with low resistivity, (3.82 μω cm annealed at 250 °C) comparable to the resistivity of bulk copper.
AB - The reduction effect of various carboxylic acids on inkjet-printed copper film was investigated. Carboxylic acids were exposed to the film by nitrogen gas that was bubbled through the liquid acids during the annealing process. It was observed that in the case of saturated monocarboxylic acid (formic, acetic, propionic, butyric), the acids with shorter hydrocarbon chains perform better in reducing the surface copper oxides in the printed copper conductive film. The printed films exposed to formic acid vapor exhibited the lowest resistivity (3.10 and 2.30 μω cm when annealed at 200 and 250 °C, respectively). In addition, the oxalic acid more effectively reduces copper oxide than formic acid and its usage can shorten the annealing time for highly conductive printed copper film. This reductive annealing process allows fabrication of copper patterns with low resistivity, (3.82 μω cm annealed at 250 °C) comparable to the resistivity of bulk copper.
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U2 - 10.1021/am2002907
DO - 10.1021/am2002907
M3 - Article
C2 - 21612230
AN - SCOPUS:80053620176
SN - 1944-8244
VL - 3
SP - 2377
EP - 2382
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 7
ER -