Dynamic thermal management for 3D multicore processors under process variations

Hyejeong Hong, Jaeil Lim, Hyunyul Lim, Sungho Kang

Research output: Contribution to journalArticlepeer-review


Stacking core layers is emerging as an alternative for future high performance computing, but thermal problems have to be tackled first. When adaptive voltage scaling is adopted to hide the growing variation in the performance of cores, as a result, heat generation of each core varies. By exploiting the static thermal characteristics, the efficiency of dynamic thermal management can be improved. The proposed thermal management reduces the energy consumption by up to 30.02% compared with existing techniques, while keeping the ratio of temperature violations around 1%.

Original languageEnglish
Article number20130800
Journalieice electronics express
Issue number23
Publication statusPublished - 2013 Nov 14

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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