TY - GEN
T1 - Development of flexible tactile sensor based on contact resistance of integrated carbon nanotubes
AU - Lee, J. I.
AU - Pyo, S.
AU - Kim, M. O.
AU - Chung, T.
AU - Lee, H. K.
AU - Lim, S. C.
AU - Park, J.
AU - Kim, J.
PY - 2013
Y1 - 2013
N2 - We have developed a novel three dimensional tactile sensor based on vertically aligned carbon nanotubes. The carbon nanotubes were directly synthesized on silicon microstructures and these CNTs-on-microstructures were integrated to flexible polydimethylsiloxane layers. Each tactile sensor has four sensing parts and the direction of force can be detected by monitoring the increase or decrease of electrical resistance in each sensing part. High gauge factor up to 272 and fast response less than 10 ms have been experimentally verified from the presented tactile sensor. The deviated contact resistance change from the initial value was less than 3% after repeated force input of 15 mN for 180,000 cycles.
AB - We have developed a novel three dimensional tactile sensor based on vertically aligned carbon nanotubes. The carbon nanotubes were directly synthesized on silicon microstructures and these CNTs-on-microstructures were integrated to flexible polydimethylsiloxane layers. Each tactile sensor has four sensing parts and the direction of force can be detected by monitoring the increase or decrease of electrical resistance in each sensing part. High gauge factor up to 272 and fast response less than 10 ms have been experimentally verified from the presented tactile sensor. The deviated contact resistance change from the initial value was less than 3% after repeated force input of 15 mN for 180,000 cycles.
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U2 - 10.1109/MEMSYS.2013.6474170
DO - 10.1109/MEMSYS.2013.6474170
M3 - Conference contribution
AN - SCOPUS:84875480045
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 37
EP - 40
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -