The improvement of thermal efficiency in the light emitting diode (LED) is one of challenging topics for the wide use of high brightness LED since the excessive heat generated in the LED junction may result in the thermally induced optical and mechanical failures. To enhance thermal reliability of high brightness LED lighting, it is important to not only use components with high thermal conductivity in LED package but also improve thermal flow to the heat sink through the metal print circuit board (MPCB) where bad thermal efficiency is caused by dielectric layer with lower thermal conductivity. This study focuses on the design and fabrication of the new structure of metal PCB based on the patterned anodizing to improve thermal dissipation. The patterned anodizing makes it possible to connect the lead frame of LED package to the metal substrate directly without any thermal loss through the dielectric layer. Thus, more efficient thermal management is expected in newly designed MPCB since total thermal resistance can be reduced. In this paper, we will be present the findings, which have been resulted from thermal simulation and measurement to demonstrate the thermal performance of newly designed MPCB.