Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF. In bonding process, the bonding force and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding temperatures are chosen between 25°C to 300°C. The bonding forces are chosen between 5N and 300N. To test the bonding strength, a bonding strength tester was designed and constructed. After the bonding strength test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.
|Journal||Proceedings of SPIE - The International Society for Optical Engineering|
|Publication status||Published - 2005|
|Event||Optomechatronic Actuators and Manipulation - Sappora, Japan|
Duration: 2005 Dec 5 → 2005 Dec 7
Bibliographical noteFunding Information:
The authors gratefully acknowledge support for this work from the Office of Naval Research and the National Science Foundation (CHE 9311614 and the Chemical Instrumentation Program for the purchase of the external source mass spectrometer). We also thank Mr. Joseph Shalosky and Dr. Chadin Dejsupa for their assistance in constructing the modified FTICR cell and the internal electrospray assembly.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering