Abstract
A depth camera is widely used in various applications because it provides a depth image of the scene in real time. However, due to the limited power consumption, the depth camera presents severe noises, incapable of providing the high quality 3D data. Although the smoothness prior is often employed to subside the depth noise, it discards the geometric details so to degrade the distance resolution and hinder achieving the realism in 3D contents. In this paper, we propose a perceptual-based depth image enhancement technique that automatically recovers the depth details of various textures, using a statistical framework inspired by human mechanism of perceiving surface details by texture priors. We construct the database composed of the high quality normals. Based on the recent studies in human visual perception (HVP), we select the pattern density as a primary feature to classify textures. Upon the classification results, we match and substitute the noisy input normals with high quality normals in the database. As a result, our method provides the high quality depth image preserving the surface details.
Original language | English |
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Title of host publication | Proceedings of SPIE-IS and T Electronic Imaging - Human Vision and Electronic Imaging XX |
Editors | Bernice E. Rogowitz, Thrasyvoulos N. Pappas, Huib de Ridder |
Publisher | SPIE |
ISBN (Electronic) | 9781628414844 |
DOIs | |
Publication status | Published - 2015 |
Event | Human Vision and Electronic Imaging XX - San Francisco, United States Duration: 2015 Feb 9 → 2015 Feb 12 |
Publication series
Name | Proceedings of SPIE - The International Society for Optical Engineering |
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Volume | 9394 |
ISSN (Print) | 0277-786X |
ISSN (Electronic) | 1996-756X |
Other
Other | Human Vision and Electronic Imaging XX |
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Country/Territory | United States |
City | San Francisco |
Period | 15/2/9 → 15/2/12 |
Bibliographical note
Publisher Copyright:© 2015 SPIE-IS&T.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering