Densification method of screen printed PZT(52/48) thick films

Yong Bum Kim; Tae Song Kim; Kyo Sook Choi; Doo Jin Choi

doi:10.1080/10584580108016901

Densification method of screen printed PZT(52/48) thick films

Yong Bum Kim, Tae Song Kim, Kyo Sook Choi, Doo Jin Choi

Department of Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

10 Citations (Scopus)

Abstract

The main problems of the screen printing method are the poor densification and the reaction between the PZT thick films and the Si substrate. For preventing these phenomena, this study adopted hybrid method of screen printing and PZT sol-gel application. PZT(52/48) thick films of 20-40 μm were prepared on Pt/TiO₂/YSZ/SiO₂/Si substrate. For the sol-gel treated thick films, a remanent polarization of 10.8 to 14.0 μC/cm², dielectric constant of 517 to 590, and a piezoelectric constant(d₃₃) of 177.0 to 199.9 pC/N were obtained. These results show that the electrical properties of sol-gel treated films is higher than that of only screen printed films. This study shows one of the methods to improve the screen printed thick film's quality and a good solution for the PZT thick film fabrication process on Si-wafer substrate.

Original language	English
Pages (from-to)	199-208
Number of pages	10
Journal	Integrated Ferroelectrics
Volume	35
Issue number	1-4
DOIs	https://doi.org/10.1080/10584580108016901
Publication status	Published - 2001
Event	12th Interntional Symposium on Integrated Ferroelectrics - Aachen, Germany Duration: 2000 Mar 12 → 2000 Mar 15

Bibliographical note

Funding Information:
The effect of PZT sol application on the PZT(52/48) thick film fabrication using screen printing method was investigated. This method has a merit in taking advantage of the possibility to lower the sintering temperature until about 800-850“ C and improving electrical properties and the adhesion between the thick film and the substrate. Considering other results reported on PZT thick films using screen printing method, this study shows one of the methods to improve the screen printed thick films quality and a good solution for the PZT thick film fabrication problems on Si-wafer Acknowledgement The authors would like to thank D G. Kim and H. G. Kim (Dept of Mat. Sci.& Eng., KAIST) for their sincere helps on the piezoelectric coefficient measurements. They also thanks for the financial support of “the research of the G7 about Micro Machine Research” program (MOCIE/MOST).

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Control and Systems Engineering
Ceramics and Composites
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1080/10584580108016901

Cite this

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title = "Densification method of screen printed PZT(52/48) thick films",

abstract = "The main problems of the screen printing method are the poor densification and the reaction between the PZT thick films and the Si substrate. For preventing these phenomena, this study adopted hybrid method of screen printing and PZT sol-gel application. PZT(52/48) thick films of 20-40 μm were prepared on Pt/TiO2/YSZ/SiO2/Si substrate. For the sol-gel treated thick films, a remanent polarization of 10.8 to 14.0 μC/cm2, dielectric constant of 517 to 590, and a piezoelectric constant(d33) of 177.0 to 199.9 pC/N were obtained. These results show that the electrical properties of sol-gel treated films is higher than that of only screen printed films. This study shows one of the methods to improve the screen printed thick film's quality and a good solution for the PZT thick film fabrication process on Si-wafer substrate.",

author = "Kim, {Yong Bum} and Kim, {Tae Song} and Choi, {Kyo Sook} and Choi, {Doo Jin}",

note = "Funding Information: The effect of PZT sol application on the PZT(52/48) thick film fabrication using screen printing method was investigated. This method has a merit in taking advantage of the possibility to lower the sintering temperature until about 800-850“ C and improving electrical properties and the adhesion between the thick film and the substrate. Considering other results reported on PZT thick films using screen printing method, this study shows one of the methods to improve the screen printed thick films quality and a good solution for the PZT thick film fabrication problems on Si-wafer Acknowledgement The authors would like to thank D G. Kim and H. G. Kim (Dept of Mat. Sci.& Eng., KAIST) for their sincere helps on the piezoelectric coefficient measurements. They also thanks for the financial support of “the research of the G7 about Micro Machine Research” program (MOCIE/MOST).; 12th Interntional Symposium on Integrated Ferroelectrics ; Conference date: 12-03-2000 Through 15-03-2000",

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N1 - Funding Information: The effect of PZT sol application on the PZT(52/48) thick film fabrication using screen printing method was investigated. This method has a merit in taking advantage of the possibility to lower the sintering temperature until about 800-850“ C and improving electrical properties and the adhesion between the thick film and the substrate. Considering other results reported on PZT thick films using screen printing method, this study shows one of the methods to improve the screen printed thick films quality and a good solution for the PZT thick film fabrication problems on Si-wafer Acknowledgement The authors would like to thank D G. Kim and H. G. Kim (Dept of Mat. Sci.& Eng., KAIST) for their sincere helps on the piezoelectric coefficient measurements. They also thanks for the financial support of “the research of the G7 about Micro Machine Research” program (MOCIE/MOST).

PY - 2001

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N2 - The main problems of the screen printing method are the poor densification and the reaction between the PZT thick films and the Si substrate. For preventing these phenomena, this study adopted hybrid method of screen printing and PZT sol-gel application. PZT(52/48) thick films of 20-40 μm were prepared on Pt/TiO2/YSZ/SiO2/Si substrate. For the sol-gel treated thick films, a remanent polarization of 10.8 to 14.0 μC/cm2, dielectric constant of 517 to 590, and a piezoelectric constant(d33) of 177.0 to 199.9 pC/N were obtained. These results show that the electrical properties of sol-gel treated films is higher than that of only screen printed films. This study shows one of the methods to improve the screen printed thick film's quality and a good solution for the PZT thick film fabrication process on Si-wafer substrate.

AB - The main problems of the screen printing method are the poor densification and the reaction between the PZT thick films and the Si substrate. For preventing these phenomena, this study adopted hybrid method of screen printing and PZT sol-gel application. PZT(52/48) thick films of 20-40 μm were prepared on Pt/TiO2/YSZ/SiO2/Si substrate. For the sol-gel treated thick films, a remanent polarization of 10.8 to 14.0 μC/cm2, dielectric constant of 517 to 590, and a piezoelectric constant(d33) of 177.0 to 199.9 pC/N were obtained. These results show that the electrical properties of sol-gel treated films is higher than that of only screen printed films. This study shows one of the methods to improve the screen printed thick film's quality and a good solution for the PZT thick film fabrication process on Si-wafer substrate.

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Densification method of screen printed PZT(52/48) thick films

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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