Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

Oh Jin Young; Sunghee Kim; Hong Koo Baik; Unyong Jeong

doi:10.1002/adma.201670155

Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

Oh Jin Young, Sunghee Kim, Hong Koo Baik, Unyong Jeong

Department of Materials Science and Engineering

Research output: Contribution to journal › Comment/debate › peer-review

9 Citations (Scopus)

Original language	English
Pages (from-to)	4564
Number of pages	1
Journal	Advanced Materials
Volume	28
Issue number	22
DOIs	https://doi.org/10.1002/adma.201670155
Publication status	Published - 2016 Jun 8

All Science Journal Classification (ASJC) codes

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.201670155

Cite this

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title = "Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)",

author = "{Jin Young}, Oh and Sunghee Kim and Baik, {Hong Koo} and Unyong Jeong",

year = "2016",

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language = "English",

volume = "28",

pages = "4564",

journal = "Advanced Materials",

issn = "0935-9648",

publisher = "Wiley-VCH Verlag",

number = "22",

}

TY - JOUR

T1 - Deformable Electronics

T2 - Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

AU - Jin Young, Oh

AU - Kim, Sunghee

AU - Baik, Hong Koo

AU - Jeong, Unyong

PY - 2016/6/8

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M3 - Comment/debate

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SN - 0935-9648

VL - 28

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JO - Advanced Materials

JF - Advanced Materials

IS - 22

ER -

Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

All Science Journal Classification (ASJC) codes

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