Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

Jaewoo Shim, Sang Hoon Bae, Wei Kong, Doyoon Lee, Kuan Qiao, Daniel Nezich, Yong Ju Park, Ruike Zhao, Suresh Sundaram, Xin Li, Hanwool Yeon, Chanyeol Choi, Hyun Kum, Ruoyu Yue, Guanyu Zhou, Yunbo Ou, Kyusang Lee, Jagadeesh Moodera, Xuanhe Zhao, Jong Hyun AhnChristopher Hinkle, Abdallah Ougazzaden, Jeehwan Kim

Research output: Contribution to journalArticlepeer-review

163 Citations (Scopus)


Although flakes of two-dimensional (2D) heterostructures at the micrometer scale can be formed with adhesive-tape exfoliation methods, isolation of 2D flakes into monolayers is extremely time consuming because it is a trial-and-error process. Controlling the number of 2D layers through direct growth also presents difficulty because of the high nucleation barrier on 2D materials. We demonstrate a layer-resolved 2D material splitting technique that permits high-throughput production of multiple monolayers of wafer-scale (5-centimeter diameter) 2D materials by splitting single stacks of thick 2D materials grown on a single wafer. Wafer-scale uniformity of hexagonal boron nitride, tungsten disulfide, tungsten diselenide, molybdenum disulfide, and molybdenum diselenide monolayers was verified by photoluminescence response and by substantial retention of electronic conductivity. We fabricated wafer-scale van der Waals heterostructures, including field-effect transistors, with single-atom thickness resolution.

Original languageEnglish
Pages (from-to)665-670
Number of pages6
Issue number6415
Publication statusPublished - 2018 Nov 9

Bibliographical note

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© 2018 American Association for the Advancement of Science. All rights reserved.

All Science Journal Classification (ASJC) codes

  • General


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