Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). Using thermal compact models of the chip and package with integrated TECs, the control principles for TEC-assisted transient cooling are presented. The control principles are implemented in a 130-nm CMOS process and cosimulated with the thermal system to show their feasibility and energy overheads. The simulation results show potential for extending the time for which a chip and package can sustain a high power load.
|Number of pages
|IEEE Transactions on Very Large Scale Integration (VLSI) Systems
|Published - 2014 Sept
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering