Conductive Polyaniline for Potential Application in Anisotropic Conductive Films

Yong Seok Ha; Hong Gyu Park; Dae Shik Seo

doi:10.1007/s11664-014-3612-5

Conductive Polyaniline for Potential Application in Anisotropic Conductive Films

Yong Seok Ha, Hong Gyu Park, Dae Shik Seo

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.

Original language	English
Pages (from-to)	1200-1205
Number of pages	6
Journal	Journal of Electronic Materials
Volume	44
Issue number	4
DOIs	https://doi.org/10.1007/s11664-014-3612-5
Publication status	Published - 2015 Apr

Bibliographical note

Publisher Copyright:
© 2015, The Minerals, Metals & Materials Society.

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-014-3612-5

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abstract = "Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.",

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AU - Ha, Yong Seok

AU - Park, Hong Gyu

AU - Seo, Dae Shik

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N2 - Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.

AB - Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.

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Conductive Polyaniline for Potential Application in Anisotropic Conductive Films

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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